Argus Embedded Systems Private Limited

Effective Cam Analysis Services are provided by us, keeping the customers’ specifications and needs in mind. These services are reckoned by the clients for their remarkable features such as on-time execution, ability to offer desired results and reasonable prices.

Argus supports following CAM verification and modifications services

• Design for manufacturing ( DFM ) analysis and evaluation
• Design for assembly ( DFA ) analysis
• Design for Test ( DFT) analysis as per specific test fixture requirement.
• Multiple Board Panelization support depending on requirement and fabrication specifications
• Verification of input files for CAM compatibility and comparison of files with fabrication drawing and notes, for accuracy of required data
• Editing and Optimization
• Verification of Opens and Shorts
• Matching of Drill Drawing and NC Drill data for accuracy
• Signal Layer Analysis for annular ring, space and trace widths
• Solder Mask Analysis and DFM for annular ring, fiduciary openings and exposed traces
• Silk Screen removal from the Solder-able Pads and Open Mask Areas.
• scoring, V-cuts, routing, slot, route and retain
• Prepration of Test coupns
• Gerber Translation
• Gerber Reconstruction
• Gerber to DXF
• DXF editing
• DXF conversion

• Design for manufacturing/Analysis (DFM) analysis and evaluation
• Design for Test (DFT) analysis as per specific test fixture requirement.
• Verification of input files for CAM compatibility and generating reports on individual board characteristics against manufacturing specifications.
• Verification of Opens and Shorts, Matching of Drill data for accuracy
• Layer Analysis for annular ring, space & trace widths, Solder Mask, fiduciary openings & exposed traces
• Silk Screen removal, scoring, V-cuts, routing, slot, route and retain, Test coupons
• Gerber Translation/Reconstruction, Gerber-DXF, DXF editing & conversion
• Panelization or board array configuration with maximum usages.

• Total client contentment
• Flexible
• Carried out by professionals

• Modeling Power Plane structures to validate DC drop in power supply rails due to copper losses
• Output available in the form of report indicating current flow and voltage at each power pins of circuit devices
• 3D Plots generation representing voltage distribution through the power planes

• Analyzing impedance of power distribution network at multiple board locations and suggesting proper decoupling schemes
• Stack up suggestions for proper board decoupling

• Simulation of plane noise due to improper decoupling schemes.

• Best analyzing tools used
• Complete solutions to system-level signal integrity issues
• Optimum quality

• Reflection Waveform Analysis
• Cross Talk Analysis
• Propagation delay and timing analysis
• Eye Diagram Analysis

• IBIS Model Creation
• IBIS Model validation

• IO Technology and chip package selection
• Placement optimization, Trace length constraints
• Board stack-up and Impedance requirements
• Signal Topology, clock distribution and termination strategies.

• Verification by extraction of actual PWD parasitic
• Placement optimization based on signal flow & trace length requirement of the specific interface
• Crosstalk level estimation
• Layer stack up recommendation
• Generation of layout constraints & guidelines
• Delay & Timing determination
• Reflections analysis and determination of termination scheme.

• EMI compatibility
• Easy to execute
• Affordable

• Radiated Emissions (RE) simulation and analysis
• Near Filed (magnetic) Emission simulation and analysis
• Far Filed (electrical) Emission simulation and analysis
• Multiple Board EMI analysis for electronic systems and sub-systems
• Full Board level radiated emissions analysis
• Net level radiated emissions for quick turn analysis
• EMC emission testing (RE, CE)
• EMC Immunity Testing (ESD, Harmonics and flicker, EFT, voltage dips and interrupts).

• Heat resistance
• Detection and correction of hot spots
• Cost effective

• Board and system level Thermal Design, simulation and analysis
• PCB data import through IDF files available from all industry leading EDA tools
• Component Junction and case temperature computation
• Thermal profiles generation for components and PCB
• Simulation of Metal Core Designs and verification of the cooling effects and application design modifications
• Reports consist of board temperature and gradients, excess temperature, 3D airflow and temperature distribution
• Detection and correction of hot spots
• Can evaluate boards of applications like Space, Avionic, Telecom, Industrial, Computer, Instrumentation, Automotive & Power supplies
• Support on Heat Sink Design.