Argus Embedded Systems Private Limited

• Hi tech technology used
• Affordable
• Timely completed

We offer a complete solution for backplane fabrication and assembly from our cost-competitive manufacturing facilities in North America and China.

We can build all types and sizes of backplanes, including some of the largest and most sophisticated back-panels in the world.

Capabilities:

Layer count up to 60 layers

Panel size up to 50"x24", 1270x610mm

Maximum thickness 0.400”, 10mm

Aspect ratio 16:1

Impedance control single and differential lines

Blind vias/controlled-depth drilling

Backdrilling multiple depths from both sides

Standard FR4 to low-loss material and hybrids

We offer both leaded and lead-free processes, to assemble components onto a printed circuit backplane board. Components include active and passive devices, thru-hole (soldered) components, press fit (compliant) components, and a variety of mounting hardware. Full test and AOI capabilities insure the highest quality delivered products.

Advantages of Ceramic Printed Circuit Boards:

• Ceramic PCBs offer higher thermal conductivity and a low expansion coefficient (CTE). Aluminum Oxide has 20 times higher conductivity than FR4, while Aluminum Nitride and Silicon Carbide are 100 times better in conductivity. Boron Nitride has the highest thermal conductivity so far.
• High temperature resistance and high electrical insulation performance
• Good mechanical strength and can withstand high load including shock and vibration
• Good chemical stability and Low Frequency loss
• High-impedance tracing can be implemented easily
• Useful in the production of multi-layer PCB boards
• Less expensive than metal (Cu/ Al) core PCBs

• Several different automated Testing approaches can be adopted depending upon the type of circuit (RF, Digital, Analogue, etc), the degree of testing required.
• Functional and Performance testing with Automatic Test Equipments
• In-Circuit Test (ICT), JTAG boundary scan Based Automated Testing.
• End-of-line (EOL) testing for Functionality and Performance.

• Optimum finish
• High strength
• Accurate dimension

• Paper Phenolic (FR1/FR2)Glass Epoxy (FR4 Tg 140/170/180)Composite (CEM-1)GETEK Rogers High Frequency Laminates PTFE DS-multilayer Hybrid BT DS-multilayer Hybrid Polyimide, Duroid

• HASL Solder with reflow White Tin Selective/all body Electroplated Nickel and Gold Electroless Nickel and Immersion Gold (ENIG)Immersion Silver Bare Copper/ Entek (OSP Plating)Lead Free HASL Conductive Carbon Printing and peelable Mask

We have dedicated and quick-turnaround operations capable of delivering PCB prototypes with lead time as short as 48 hours.

our integrated solutions provide a seamless flow to meet both mid and large scale PCB manufacturing requirements. The transition to volume production is simplified by utilizing our integrated PCB model of NPI through high-volume, cost-effective production, all through a single provider.

we are largest supplier of printed circuit boards and custom assemblies to the Aerospace and Defence industries. Superior reliability is the overriding issue for military and aerospace electronics. Regardless of application, they must perform in the most extreme environment and hazardous situations.

As military and aerospace electronics are reduced in size to increase functionality and reduce weight, they incorporate new technologies that need to be thoroughly tested and proven reliable. These new processes must be characterized "stable and controlled" before they can be implemented in mission-critical applications.

Thick film hybrid microcircuit technology involves the precision screen printing and firing of conductors, resistors and dielectrics onto a ceramic, titanium or stainless steel substrate for multilayer circuitry.

Resistors are laser trimmed to achieve precise values and this can be done after surface mount assembly to achieve functional circuit adjustment.

A wide range of resistor values from milli-ohms to giga-ohms along with ratings of up to tens of thousands of volts and fractional ratio tolerances are achieved.

Assembly is performed using surface mount components and pick and place technology or, alternatively, silicon chips and wire bonding are used.

HDI PCB

HDI is one of the more complex board fabrication processes we specialize in. We use SBU technology, which allows sequential addition of more pairs of layers to form a multilayer core, to create this type of highly integrated PCB.
SBU is a multilayer technology that can be achieved by putting a dielectric element and a copper foil on both top and bottom of the core before it is submitted to laser drilling, image transferring, and etching processes. Multilayer PCBs designed through this technological procedure are marked by a sequence of numbers and Ns, (e.g., 1+N+1, 2+N+2, etc.), where N represents the number of layers that form the core and the numerical values represent the number of layers added.
At our facility in Taiwan, we have successfully created so far HDI-SBU with sequencing reaching Any-Layer Interstitial Via Hole (ALIVH) in HDI fabrication. We achieve this by applying a metallization technique to interconnect via holes (IVHs). This method not only offers stronger interconnection of stacked vias, but also achieves better thermal management, which significantly increases board reliability at severe circumstances.
We fabricate every piece of HDI SBUs in-house thanks to our complete range of advanced machines and equipment. Among the advanced equipment we own and operate include Laser Direct Imaging machines, which can provide reliable and repeatable 2/2 mils with the limited solder mask clearance of 1 mil. With such advanced equipment, we are also capable of fabricating probe cards, DUTs, and load boards for use in the semiconductors industry as well as burn-in boards of up to 50 layers on a 0.276-inch thick board with an aspect ratio of 20:1, metal core, and substrate PCBs containing 1.50 mils trace and space.

Capabilities
Laser drill machine Mitsubishi 605GTX II
Laser via Stacked via/Stepped

structure via/Skipped via
Thinnest dielectric 2 mils
Thickest dielectric 4.5 mils
(for 6 mils via hole size)
Smallest trace width 2 mils
Smallest air gap 2 mils
Build Up 1+N+1
2+N+2
3+N+3
4+N+4
Smallest laser via pad Outer layer 7 mils
Inner layer 9 mils
Smallest via diameter Laser 3 mils