Printed Circuit Board

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HDI PCB

HDI is one of the more complex board fabrication processes we specialize in. We use SBU technology, which allows sequential addition of more pairs of layers to form a multilayer core, to create this type of highly integrated PCB.
SBU is a multilayer technology that can be achieved by putting a dielectric element and a copper foil on both top and bottom of the core before it is submitted to laser drilling, image transferring, and etching processes. Multilayer PCBs designed through this technological procedure are marked by a sequence of numbers and Ns, (e.g., 1+N+1, 2+N+2, etc.), where N represents the number of layers that form the core and the numerical values represent the number of layers added.
At our facility in Taiwan, we have successfully created so far HDI-SBU with sequencing reaching Any-Layer Interstitial Via Hole (ALIVH) in HDI fabrication. We achieve this by applying a metallization technique to interconnect via holes (IVHs). This method not only offers stronger interconnection of stacked vias, but also achieves better thermal management, which significantly increases board reliability at severe circumstances.
We fabricate every piece of HDI SBUs in-house thanks to our complete range of advanced machines and equipment. Among the advanced equipment we own and operate include Laser Direct Imaging machines, which can provide reliable and repeatable 2/2 mils with the limited solder mask clearance of 1 mil. With such advanced equipment, we are also capable of fabricating probe cards, DUTs, and load boards for use in the semiconductors industry as well as burn-in boards of up to 50 layers on a 0.276-inch thick board with an aspect ratio of 20:1, metal core, and substrate PCBs containing 1.50 mils trace and space.

Capabilities
Laser drill machine Mitsubishi 605GTX II
Laser via Stacked via/Stepped

structure via/Skipped via
Thinnest dielectric 2 mils
Thickest dielectric 4.5 mils
(for 6 mils via hole size)
Smallest trace width 2 mils
Smallest air gap 2 mils
Build Up 1+N+1
2+N+2
3+N+3
4+N+4
Smallest laser via pad Outer layer 7 mils
Inner layer 9 mils
Smallest via diameter Laser 3 mils

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Additional Information:

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We have dedicated and quick-turnaround operations capable of delivering PCB prototypes with lead time as short as 48 hours.

our integrated solutions provide a seamless flow to meet both mid and large scale PCB manufacturing requirements. The transition to volume production is simplified by utilizing our integrated PCB model of NPI through high-volume, cost-effective production, all through a single provider.

Approx. Rs 5,000 / LotGet Latest Price

• Hi tech technology used
• Affordable
• Timely completed

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IC substrates serve as the connection between IC chips and the PCB through a conductive network of traces and holes. IC substrates support critical functions including circuit support and protection, heat dissipation, and signal and power distribution.

IC substrates represent the highest level of miniaturization in PCB manufacturing and shares many similarities with semiconductor manufacturing. We supply many types of IC substrates on which IC chips are attached to the IC substrate utilizing wire bonding and, or flip chip methods.

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Thick film hybrid microcircuit technology involves the precision screen printing and firing of conductors, resistors and dielectrics onto a ceramic, titanium or stainless steel substrate for multilayer circuitry.

Resistors are laser trimmed to achieve precise values and this can be done after surface mount assembly to achieve functional circuit adjustment.

A wide range of resistor values from milli-ohms to giga-ohms along with ratings of up to tens of thousands of volts and fractional ratio tolerances are achieved.

Assembly is performed using surface mount components and pick and place technology or, alternatively, silicon chips and wire bonding are used.