Argus Embedded Systems Private Limited

• Modern techniques used
• Cost effective
• Timely completed

• Rendered by experts
• Flexible
• Best available resources are used

• RTL Design
• RTL Verification
• RTL Synthesis
• DFT
• Physical Design [Layout/Verification]
• Analog & Mixed Signal [Design/Custom Layout/Verification]
• Pre / Post Silicon Validation
• FPGA Design / Porting
• PCB Design [Design/Layout/Testing]
• Misc – Lib Development, Characterization, Modeling etc.

We offer IC package design services for emerging design technologies like Flip Chip,stacked die,POP,PIP in addition to wire bond technology for mixed signal and RF-IC products.

The main package design service categories are CSP,Wire Bond BGA,Flip Chip BGA

• We have VLSI resource who has experience in Verilog and have worked in defence projects. We provide resources for short term or long term on contract basis or for permanent hiring as company requirement.
• Basic Job profile of candidates:
• Good in Verilog programming/Debugging/able to write synthesizable codes.
• A very good understanding and hands on working level experience in basic digital building blocks/logic modules .
• Worked in top level SoC integration of processor cores with standard Peripherals..
• Good in the debugging the HDL codes and be able to make progress by identifying and fixing the issues/bugs in the design.
• Experience in the standard FPGA architectures, FPGA based system design and IP development