VLSI Engineering services enables our clients to develop ASIC from concept till production. Our VLSI experts come with vast industry experience and wide semiconductor industry exposure which gives a unique flavor to our customers who require a wide variety of skills and expertise. Within the VLSI practice, we have multiple vertical offerings, which align and cater to the end-to-end outsourcing needs of our customers.
₹ 10000 / Piece Get Latest Price
| FPGA Vendor | Intel (Altera), Lattice, Xilinx, Microchip |
| Design Type | DSP Design, High Speed Interface, SoC FPGA, IP Core Design, RTL Design |
| HDL Language | VHDL, SystemVerilog, Mixed, Verilog |
| Max Logic Elements | Above 500k |
| Clock Speed Range | Above 400 MHz |
| Tool Chain | ISE, Quartus, Vivado, Libero |
| Type of Service Provider | Designing Firm |
| Type of Service Contract | Project Based |
| Board Design Support | Yes |
| Verification Support | Gate Level, UVM, In System, Functional |
| Target Application | Industrial, Telecom, Defence, Automotive, Consumer |
| FPGA | Lattice |
Minimum order quantity: 1 Piece
₹ 25000 / Piece Get Latest Price
| Design Domain | Mixed Signal, RF, Analog, SoC, Digital |
| Design Stage | Frontend Design, DFT, Physical Design, Signoff, Verification |
| Process Node | Below 7 nm |
| Industry | Industrial |
| Service Location | India |
| Tool Suite | Cadence, Mixed EDA, Mentor, Synopsys |
| Target Application | IoT, Automotive, Industrial, Consumer, Mobile, Networking |
| Engagement Model | Offshore, Onsite, Project Based, Turnkey, Staff Augmentation |
| Type of Service Provider | Designing Firm |
| Type of Service Contract | Project Based |
| Foundry Experience | TSMC |
| IP Development | Interface IP, Memory, Standard Cell |
Minimum order quantity: 1 Piece
₹ 2000 / Unit Get Latest Price
| Design Domain | Analog, RF, Digital, SoC, Mixed Signal |
| Design Stage | DFT, Frontend Design, Verification, Physical Design, Signoff |
| Process Node | Below 7 nm |
| Industries Served | All types of domains |
| Target Application | Automotive, Mobile, Networking, IoT, Consumer, Industrial |
| Engagement Model | Onsite, Turnkey, Project Based, Staff Augmentation, Offshore |
| Type of Technology | CAD / CAM |
| Type of Service Provider | Designing Firm |
| Type of Service Contract | Project Based |
| Foundry Experience | TSMC |
| IP Development | Standard Cell, Interface IP, Memory |
Minimum order quantity: 1 Unit
₹ 40000 / Piece Get Latest Price
| Engagement Type | IP Level, Full Chip, Consulting, Block Level |
| Design Stage | Physical Design, Verification, Signoff, DFT |
| Process Node | Below 7 nm |
| Service Location | India USA |
| EDA Tools | Cadence |
| Application Area | Industrial, Automotive |
| Delivery Model | Staff Augmentation |
| Industries Served | Automotive |
| Course Location | Ahmedabad |
| Type Of Service Provider | Designing Firm |
| Type Of Technology | CAD / CAM |
| Type Of Service Contract | Project Based |
| Course Name | Development |
Minimum order quantity: 1 Piece
We offer IC package design services for emerging design technologies like Flip Chip,stacked die,POP,PIP in addition to wire bond technology for mixed signal and RF-IC products.
The main package design service categories are CSP,Wire Bond BGA,Flip Chip BGA
Dhiraj Kumar (Executive Business Development)
Argus Embedded Systems Private Limited
PLOT NO.36,PHASE - III,KAMALAPURI COLONY,KAMALAPURI COLONY
Hyderabad - 500073, Telangana, India