Argus Embedded Systems Private Limited

·        BGA Reworks and BGA Reballing are done with the aid of automatic BGA re-workstation, in which the thermal profile for de-soldering, soldering & re-balling are pre-programmed.

·        BGA Reballing is an effective method of repairing BGA components that have failed due to damaged or missing solder balls.

·        Instead of replacing the entire component, BGA reballing involves removing the faulty solder balls and replacing them with new ones.

·        The Process of BGA Reballing includes steps such as Removal of old solder balls, Cleaning the chip and applying new solder paste, placing new solder balls, Reheating the chip, and cleaning the chip again.

• Best technology used
• Cost effective
• Total client contentment

• Automatic Placement of CBGA, PBGA and uBGA
• Removing & Replacing BGA, uBGA, Flipchip, CSP
• Reballing of BGA and uBGA
• Verification of BGA’s using x-ray system

• With proven process and Industry standard equipment's and backed by skilled professionals , argus offers High yield rate PCB Assemblies Having micro Ball Grid Array and leadless packages.
• Precise Placement of LGA, CBGA, PBGA and uBGA’s with aid of automated BGA Rework station.
• Diverse re-flow profiles & 300x magnification for ball to pad matching to work with BGA’s with pitch size from 0.3 mm.
• Removal & Replacement of LGA, BGA, uBGA, Flipchip, CSP’s.
• uBGA & BGA Rework.
• BGA Reballing of 0.4mm, 0.5mm, 0.8mm, 1mm BGA chip with specilaised BGA Reballing Process.
• Verification of BGA assembly, BGA rework using x-ray system.