BGA Assembly

  • Automatic Placement of CBGA, PBGA and uBGA.
  • Removing & Replacing BGA, uBGA, Flipchip, CSP.
  • Reballing of BGA and uBGA.
  • Verification of BGA’s using x-ray system.

Bga Assembly Services

₹ 500/Piece Get Latest Price

Product Brochure
Automation GradeAutomatic
Surface FinishHAL, ENIG
BGA pitchmin 0.4mm
Solder typeRoHS
PackageCBGA, PBGA and micro BGA
Other supportBGA reballing
QABGA Xray
ProcessReflow
Country of OriginMade in India

Minimum order quantity: 1 Piece

Backed by consistent efforts of our skilled professionals, we are engaged in offering BGA Assembly, BGA Rework, BGA Reballing. Our customers can rely on us to build top quality and good yield rate BGA boards, for this we have advance equipments & tools. This service is rendered only after considering this all aspects & completed within promised time to customers.

Other Details:

  • Best technology used
  • Cost effective
  • Total client contentment

Specifications:

  • Automatic Placement of CBGA, PBGA and uBGA
  • Removing & Replacing BGA, uBGA, Flipchip, CSP
  • Reballing of BGA and uBGA
  • Verification of BGA’s using x-ray system

Bga Reballing Services

₹ 500/Piece Get Latest Price

Product Brochure
Board TypeMulti Layered
Service LocationIndia
Usage/ApplicationElectronics
Country of OriginMade in India

Minimum order quantity: 1 Piece

·        BGA Reworks and BGA Reballing are done with the aid of automatic BGA re-workstation, in which the thermal profile for de-soldering, soldering & re-balling are pre-programmed.

·        BGA Reballing is an effective method of repairing BGA components that have failed due to damaged or missing solder balls.

·        Instead of replacing the entire component, BGA reballing involves removing the faulty solder balls and replacing them with new ones.

·        The Process of BGA Reballing includes steps such as Removal of old solder balls, Cleaning the chip and applying new solder paste, placing new solder balls, Reheating the chip, and cleaning the chip again.

Bga Rework Service

₹ 500/Piece Get Latest Price

Product Brochure
Country of OriginMade in India

Minimum order quantity: 1 Piece

  • With proven process and Industry standard equipment's and backed by skilled professionals , argus offers High yield rate PCB Assemblies Having micro Ball Grid Array and leadless packages.
  • Precise Placement of LGA, CBGA, PBGA and uBGA’s with aid of automated BGA Rework station.
  • Diverse re-flow profiles & 300x magnification for ball to pad matching to work with BGA’s with pitch size from 0.3 mm.
  • Removal & Replacement of LGA, BGA, uBGA, Flipchip, CSP’s.
  • uBGA & BGA Rework.
  • BGA Reballing of 0.4mm, 0.5mm, 0.8mm, 1mm BGA chip with specilaised BGA Reballing Process.
  • Verification of BGA assembly, BGA rework using x-ray system.

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Contact Us

Pradeep Kumar (Executive Business Development)
Argus Embedded Systems Private Limited
Plot No. 36, Phase-III, 1st Floor, Kamalapuri Colony
Banjara Hills Kamalapuri Colony Phase 2, Hyderabad - 500073, Telangana, India

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