Argus Embedded Systems Private Limited

Banjara Hills, Hyderabad, Telangana

GST No. 36AAJCA3639B1ZX

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BGA Assembly

  • Automatic Placement of CBGA, PBGA and uBGA.
  • Removing & Replacing BGA, uBGA, Flipchip, CSP.
  • Reballing of BGA and uBGA.
  • Verification of BGA’s using x-ray system.

Bga Reballing Services

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Bga Reballing Services
  • Bga Reballing Services
  • Bga Reballing Services
  • Bga Reballing Services
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Approx. Rs 1,000 / PieceGet Latest Price

Product Brochure
Product Details:
Minimum Order Quantity1 Piece
Board TypeMulti Layered
Service LocationIndia
Usage/ApplicationElectronics
Country of OriginMade in India

·        BGA Reworks and BGA Reballing are done with the aid of automatic BGA re-workstation, in which the thermal profile for de-soldering, soldering & re-balling are pre-programmed.

·        BGA Reballing is an effective method of repairing BGA components that have failed due to damaged or missing solder balls.

·        Instead of replacing the entire component, BGA reballing involves removing the faulty solder balls and replacing them with new ones.

·        The Process of BGA Reballing includes steps such as Removal of old solder balls, Cleaning the chip and applying new solder paste, placing new solder balls, Reheating the chip, and cleaning the chip again.


Additional Information:

  • Production Capacity: 1000
  • Delivery Time: 1 working days
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    Pradeep Kumar (Executive Business Development)
    Argus Embedded Systems Private Limited
    Plot No. 36, Phase-III, 1st Floor, Kamalapuri Colony, Banjara Hills
    Hyderabad - 500073, Telangana, India
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