Banjara Hills, Hyderabad, Telangana
GST No. 36AAJCA3639B1ZX
Approx. Rs 1,000 / PieceGet Latest Price
Product BrochureProduct Details:Minimum Order Quantity | 1 Piece |
Board Type | Multi Layered |
Service Location | India |
Usage/Application | Electronics |
Country of Origin | Made in India |
· BGA Reworks and BGA Reballing are done with the aid of automatic BGA re-workstation, in which the thermal profile for de-soldering, soldering & re-balling are pre-programmed.
· BGA Reballing is an effective method of repairing BGA components that have failed due to damaged or missing solder balls.
· Instead of replacing the entire component, BGA reballing involves removing the faulty solder balls and replacing them with new ones.
· The Process of BGA Reballing includes steps such as Removal of old solder balls, Cleaning the chip and applying new solder paste, placing new solder balls, Reheating the chip, and cleaning the chip again.
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