Argus Embedded Systems Private Limited

• PCB Assembly (UL, RoHS, ISO) with the Highest Quality and on-time delivery for surface mount (SMT Assembly), through hole (THT Assembly) and press Fit technology.
• Focus on Engineering prototypes, NPI, Rapid Prototyping, Low-mid Volume manufacturing with Quick turnaround time.
• Supports Single-sided, Double-sided, Surface mount assembly, Through-hole assembly and press fit assembly PCBA Services
• PCBA Services of surface mount and through hole components on Rigid, Flexible, and Flex-Rigid PCB's.
• Meticulous PCB assembly services backed by highly skilled professionals and processes.
• A comprehensive multi-stage QC process ensures consistent quality and high Printed Circuit Board Assembly yield.
• Production Process Includes AOI, FPT, X-ray inspection, Conformal Coating.
• Press Fit Assembly including Design and manufacturing of press fit connector assembly.

• Selective soldering is a process of soldering selected electronic components to a PCB. The components are selected by way of a program that is created using an image of the PCB specifying where flux and solder are to be applied.
• selective soldering is done by preheating, applying flux, and soldering. In both processes, the temperature of the assembly is raised before soldering (preheating).
• in selective soldering the application of flux is only to the components that are to be soldered. In this processes the PCB is exposed to a molten wave of solder. In selective soldering, only individual connections see the wave (one after the other).
• Though Selective soldering is a slower process than wave soldering but it is much more precise and it allows independent configuration of the soldering of each position.

Argus is service Provider for Military and Aerospace PCB Repair, Refurbishments & Maintenance with ability to repair virtually any electronic equipment’s or Printed Circuit Board (PCB).

Our team engineering Team specializes in repair, rework, BGA rework, Test and Inspection of electronic circuit boards and assemblies With Automatic Test Equipment and complete Lab facility and RoHS compliant PCB repair service. We are able to support all OEM, Non-Warranty, Upgrades and Obsolete repairs, for a wide range of items.

• If your assembly requires conventional THT mounted components, our team will use a wave soldering machine to automate the process. In a matter of seconds, through-hole components are soldered to the printed circuit board, resulting in mechanically and electrically reliable joints.
• Hand Soldering is used on components that cannot be wave soldered. A process requiring exceptional craftsmanship and levels of attention, our soldering engineers use a hand-held soldering iron, selecting suitably sized tips to form joints that meet the exact requirements of your assembly.
• The AESPL team will provide guidance on the most suitable techniques ( wave soldering, Selective soldering, hand soldering) to enhance the performance of your specific assembly.

• Press Fit connector Assembly including Design and manufacturing of press fit connector assembly fixture.
• Assembly of Press Fit connectors on PCB.
• Design and manufacturing of press fit tools as per connector data sheet.
• can support specific press-in force [ Typical 85 N ] as per connector specification.
• can support specific press-in speed [Typical 100mm/min] as per connector specification.
• Design and manufacturing of press out tools as per connector data sheet.
• Verification of Press fit connector PCB assembly.

• Selective soldering is a process of soldering selected electronic components to a PCB. The components are selected by way of a program that is created using an image of the PCB specifying where flux and solder are to be applied.
• selective soldering is done by preheating, applying flux, and soldering. In both processes, the temperature of the assembly is raised before soldering (preheating).
• in selective soldering the application of flux is only to the components that are to be soldered. In this processes the PCB is exposed to a molten wave of solder. In selective soldering, only individual connections see the wave (one after the other).
• Though Selective soldering is a slower process than wave soldering but it is much more precise and it allows independent configuration of the soldering of each position.

• Surface Mount Assembly

• Kitted or Turn-Key

• Engineering Prototypes Available in 24-48 Hours
• Small, Medium, to Large Production Quantities
• Quick Turn & Standard Deliveries Available

• Electronic potting is a process of filling a complete electronic assembly with a solid or gelatinous compound for resistance to shock and vibration and for the exclusion of moisture and corrosive agents.
• In the Electronic potting process, an electronic assembly is placed inside a mold which is then filled with an insulating liquid compound that hardens permanently protecting the assembly the mold is part of the finished article and can provide shielding or heat-dissipating functions in addition to acting as a mold.
• Electronic Potting compound support: Hard Tamper Proof Potting Compound, Silicone Potting Encapsulant, flexible clear transparent epoxy potting compound.

• SMT reflow pallet can be used during the entire SMT process (printing, placement and reflowing) to support, protect and transport printed circuit boards of different sizes and shapes including flex and rigid-flex PCBs.
• SMT carriers can help reduce soldering defects, improve repeatability and reduce labor cost.
• Argus SMT reflow solder pallets are custom made to meet your particular job requirements.

• Optimum finish
• Easy to install
• Precise dimension

• Development Board with Xilinx Virtex-5 LX FPGA, Octal channel 12-bit ADC, Octal channel 12-bit DAC, IO Expansion ports
• PCIE Card with Xilinx Virtex-5 LXT FPGA, IO expansion ports
• Development Board with two Spartan-3A FPGA's, Two channel 250 MSPS 8-bit ADC, Two channel 250 MSPS 8- bit DAC, IO Expansion Ports
• Development Board with Xilinx Spartan-3E FPGA, Serial interfaces (USB, UART, SPI, I2C), IO Expansion ports
• Development Board with Xilinx Spartan-3A FPGA, Parallel flash, Serial flash, cypress PSOC-5 mixed signal array, USB 2.0, IO Expansion Port
• VME Card with Lattice XP2 FPGA, Quad channel ADC, Quad channel DAC
• Development Board with Lattice XP2 FPGA, SRAM, Flash, IO expansion ports
• Development Board with Altera Stratix FPGA, SDRAM, USB, Ethernet
• Development Board with Actel IGLOO Flash FPGA, ADC, DAC, MIL 1553
• Development Board with Altera Flex 10K EPLD, SHARC ADSP-21161, ADC, DDC.